| 摘要 |
<P>PROBLEM TO BE SOLVED: To tightly stick the face of the substrate to be fixed to a stage so as to be firmly fixed, and further, to easily remove the substrate from the stage. <P>SOLUTION: The film deposition method includes: a mounting step where a vibration plate 31 is mounted on a stage 71 filled with water in a chamber 70; a solidifying step where the water is solidified, and the vibration plate 31 is tightly stuck to the surface of the stage 71 so as to be firmly fixed; a piezoelectric layer forming step/a film deposition step where the grains of a piezoelectric material are deposited on the vibration plate 31 so as to cover a region superimposed with each pressure chamber viewed from the above after joining with a flow passage unit 4, thus a piezoelectric layer 32 is formed on the upper face of the vibration plate 31; and a fusion step where ice interposed between the stage 71 and the vibration plate 31 in a solidified state is fused. <P>COPYRIGHT: (C)2010,JPO&INPIT |
