| 摘要 |
<p>Provided is a double board type imaging device (51) having two solid-state imaging elements (35, 37). The imaging device is provided with: substrates (38, 39) on which electronic components (40, 41) required for driving the solid-state imaging elements (35, 37) are mounted, respectively; two cables (43, 45) electrically connected to the substrates (38, 39), respectively; and a heat dissipating member (60) arranged between the two substrates (38, 39).</p> |
