| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module for power that does not increase its size even if current capacity increases, can be miniaturized, and can be connected to an external circuit easily. <P>SOLUTION: In the semiconductor module for power, a semiconductor element for power and a cylindrical conductor are joined to one surface of a lead frame, the opening of the cylindrical conductor is exposed to the surface of a transfer mold resin, and the terminal section of the lead frame is allowed to project from a peripheral side part and is sealed by the transfer mold resin. In the semiconductor module for power, the cylindrical conductor makes continuity with a control circuit, and the terminal section of the lead frame makes continuity with a main circuit. <P>COPYRIGHT: (C)2010,JPO&INPIT |
