发明名称 ADHERENT COMPOSITION FOR POWDER COATING, CONDUCTIVE THIN LAYER FORMED BY USING ADHERENT COMPOSITION AND METHOD FOR PREPARING ELECTRIC DEVICE
摘要 PURPOSE: An adhesive composition for coating powder is provided to economically manufacture conductive thin film with electrically excellent characteristics and to obtain a flexible conductive thin film. CONSTITUTION: An adhesive composition for coating powder comprises 0.1-80 weight% of acryl-based or silicon-based reactive vinyl monomer, 0.1-50 weight% of acryl based or silicon based oligomer, and remaining amount of reaction initiator. A electric device comprises: a substrate or substrate(10) having pre-process layer; an adhesive layer(20) containing acryl based or silicon based vinyl monomer, acryl based or silicon based reactive oligomer, and a reaction initiator, and a conductive layer(30) in which micro conductive particle is adhered.
申请公布号 KR20100062454(A) 申请公布日期 2010.06.10
申请号 KR20080121096 申请日期 2008.12.02
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 KIM, GI HEON;SONG, YOON HO
分类号 C09J133/08;C09J183/00 主分类号 C09J133/08
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