发明名称 |
ADHERENT COMPOSITION FOR POWDER COATING, CONDUCTIVE THIN LAYER FORMED BY USING ADHERENT COMPOSITION AND METHOD FOR PREPARING ELECTRIC DEVICE |
摘要 |
PURPOSE: An adhesive composition for coating powder is provided to economically manufacture conductive thin film with electrically excellent characteristics and to obtain a flexible conductive thin film. CONSTITUTION: An adhesive composition for coating powder comprises 0.1-80 weight% of acryl-based or silicon-based reactive vinyl monomer, 0.1-50 weight% of acryl based or silicon based oligomer, and remaining amount of reaction initiator. A electric device comprises: a substrate or substrate(10) having pre-process layer; an adhesive layer(20) containing acryl based or silicon based vinyl monomer, acryl based or silicon based reactive oligomer, and a reaction initiator, and a conductive layer(30) in which micro conductive particle is adhered. |
申请公布号 |
KR20100062454(A) |
申请公布日期 |
2010.06.10 |
申请号 |
KR20080121096 |
申请日期 |
2008.12.02 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
KIM, GI HEON;SONG, YOON HO |
分类号 |
C09J133/08;C09J183/00 |
主分类号 |
C09J133/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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