EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD AT THE SAME

摘要

PURPOSE: Machines and a method for manufacturing semiconductor devices are provided to increase or maximize a production yield by emitting a purge gas between a plurality of wafers mounted inside of a front opening unified pod(FOUP) in order to increase purge efficiency. CONSTITUTION: An FOUP(10) in which a plurality of wafers(1) is mounted is loaded on a load port(20). A process module(50) performs semiconductor manufacturing processes of the wafer. A transfer module(40) successively transfers the wafer between the process module and the load port. A machine front end module(30) provides a cleaning space between the process module and the load port. The machine front end module includes an opener which opens and closes the door of the FOUP. A purge module(60) purges inside of the FOUP.