发明名称 Thermally Dissipative Enclosure Having Shock Absorbing Properties
摘要 A thermally dissipative housing (200) includes a rigid housing (203) and a compliant heat spreader (215). The compliant heat spreader (215) is thermally coupled to a heat-generating component (201) disposed within the thermally dissipative housing (200). The compliant heat spreader (215) removes heat from the heat-generating component (201) and transfers it along an interior surface of the rigid housing (203) by passing along an interior (209) of the rigid housing (203) across at least a portion of the interior surface area (211) of the rigid housing (203). The compliant heat spreader (215) transfers heat to the surface of the rigid housing (203) without substantially interfering with the shock absorbing properties of the rigid housing (203).
申请公布号 US2010142154(A1) 申请公布日期 2010.06.10
申请号 US20080328478 申请日期 2008.12.04
申请人 MICROVISION, INC. 发明人 COLLET ROELAND;LUANAVA SELSO;BYEMAN THOMAS;HEGLAND JOEL E.;WHALEN RANDALL J.
分类号 H05K7/20;G03B21/16 主分类号 H05K7/20
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