发明名称 LIGHT-EMITTING DIODE PACKAGE AND MANUFACTURE METHOD THEREOF
摘要 PURPOSE: An LED(Light Emitting Diode) package and a manufacture method thereof are provided to implement heat dissipation of the LED effectively by using the single wall carbon nano tube single wall which is excellent in heat radiation property. CONSTITUTION: The Al2O3, glass, Al, CNT and additive are mixed to produce the mixture(S10). The mixture is powderized with the binder or the solvent(S20). The powderized powder mixture is dried(S30). The powder mixture dried in reducing environment is treated calcination(S40). The powder mixture is ground with a grinder(S50). The powder mixture is formed into the slurry(S60). A green sheet is manufactured using the slurry(S70).
申请公布号 KR20100062040(A) 申请公布日期 2010.06.10
申请号 KR20080120449 申请日期 2008.12.01
申请人 TOP ENGINEERING CO., LTD. 发明人 KIM, SANG HEE
分类号 H01L33/48;H01L33/64 主分类号 H01L33/48
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