| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hermetically-sealed package and a wafer level hermetically-sealed package which are excellent in productivity and quality, a method for manufacturing the hermetically-sealed package, and a method for manufacturing the wafer level hermetically-sealed package. <P>SOLUTION: The hermetically-sealed package comprises a main substrate 11, an opposing substrate 13 arranged to be nearly parallel in its main surface to the main substrate 11, and joints 25 for fixing the opposing substrate 13 and the main substrate 11. The joint 25 includes a low-melting-point solder 4 and a high-melting-point solder 2 higher in melting point than the solder 4. A space surrounded by the main substrate 11, the opposing substrate 13 and the joints 25 is made to be evacuated. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
