| 摘要 |
PROBLEM TO BE SOLVED: To shorten an entering length of a connecting axis for connecting an arm constituting a rake plate and a transfer device of a wafer carrier when the connecting axis enters an semi conductor manufacturing device, in the case where a load port device is disposed in the semiconductor manufacturing device. SOLUTION: In a transfer device A1 comprising a pair of rake plates 9a and 9b which are disposed in a load port device L and transfers a wafer carrier C by raking it from the below, a controlling motor M for moving the pair of raking plates 9a and 9b is disposed on the side of a carrier reading device R on the front view of the load port device L, and is disposed on an intermediate part between an opening 2 of a semiconductor manufacturing device H and the carrier reading device R in the top view. |
