发明名称 Aluminium-based soldering foil
摘要 The aluminum based soldering foil comprises first and second aluminum films (1, 2), between which an intermediate layer (3) is arranged. The intermediate layer consists of 18-28 mass% of alloy component such as silicon and solder emerging during heating, 60-80 mass% of flux and 3 mass% of organic binder. The binder underlies pyrolysis during soldering process and comprises a polymer. The films have a thickness of 3-15 mu m. The intermediate layer has a mass of 10-12 gram per square meter. One of the both films consists of non-alloyed aluminum or aluminum alloy with silicon portion of 0.5-12%. An independent claim is included for a method for the production of soldering foil.
申请公布号 EP2193873(A2) 申请公布日期 2010.06.09
申请号 EP20090175996 申请日期 2009.11.13
申请人 BEHR GMBH & CO. KG 发明人 ENGLERT, PETER;TRAUTWEIN, INGO;JILG, RUEDIGER;ANDIC, MUEJDAT
分类号 B23K35/02;B23K35/28;B23K35/362;B23K101/14 主分类号 B23K35/02
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