OPTIC INTERCONNECTION DEVICE

摘要

PURPOSE: An optical wiring device is provided to reduce the power consumption by minimizing a performance deterioration caused by a parasitic component on a silicon substrate. CONSTITUTION: A first semiconductor chip(301) is arranged on a SOI(Silicon-On-Insulator) substrate(300). An optical emitter(302) is inputted with an electric signal form the first semiconductor chip and outputs the optical signal. A photodetector(304) senses the optical signal and changes the optical signal into the electric signal. A second semiconductor chip is inputted with the electric signal from the photodetector. A first SOI substrate is arranged with the first semiconductor chip and the photodetector. A second SOI substrate is arranged with the second semiconductor chip and the photodetector.