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发明名称
Thermally conductive adhesive composition and adhesion method
摘要
申请公布号
KR100961460(B1)
申请公布日期
2010.06.08
申请号
KR20080048693
申请日期
2008.05.26
申请人
发明人
分类号
C09J133/08;C09J133/10
主分类号
C09J133/08
代理机构
代理人
主权项
地址
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