| 发明名称 |
Simultaneous grain modulation for BEOL applications |
| 摘要 |
The invention is directed to an improved semiconductor structure, such that within the same insulating layer, Cu interconnects embedded within the same insulating level layer have a different Cu grain size than other Cu interconnects embedded within the same insulating level layer.
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| 申请公布号 |
US7732922(B2) |
申请公布日期 |
2010.06.08 |
| 申请号 |
US20080970149 |
申请日期 |
2008.01.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YANG CHIH-CHAO;HSU LOUIS C.;JOSHI RAJIV V. |
| 分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
| 代理机构 |
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