A SUBSTRATE HAVING A METAL POST AND A FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A substrate and a manufacturing method thereof are provided to improve coupling reliability between a metal post and a round solder bump by forming a surface processing layer on the upper side of the metal post. CONSTITUTION: A connection pad(104) is formed on a base substrate(102). A solder resist layer(106) is formed on the base substrate. An open unit of the solder resist layer exposes the connection pad. A metal post(116) is connected to the connection pad. The metal post is protruded to the upper side of the solder resist layer. A solder bump(122) includes a round type solder bump and an oxidation solder bump film. The round type solder bump is formed on the upper side of the metal post. The solder bump film for preventing oxidation is formed on the side of the metal post.