发明名称 |
SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME |
摘要 |
PURPOSE: A substrate polishing device and a substrate polishing method using the same are provided to improve the reliability of products by fixing and installing a polishing end point detector on the upper side of a substrate support member aside from a polishing unit. CONSTITUTION: A substrate support member(100) receives a substrate on the upper side thereof and rotates the substrate. A polishing unit(300) polishes the substrate received on the substrate support member. A polishing end point detector(400) is fixed to the upper side of the substrate support member and detects the polishing end point of the substrate received in the substrate support member.
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申请公布号 |
KR20100060656(A) |
申请公布日期 |
2010.06.07 |
申请号 |
KR20080119342 |
申请日期 |
2008.11.28 |
申请人 |
SEMES CO., LTD. |
发明人 |
KWON, OH JIN;KIM, SEONG SOO |
分类号 |
H01L21/304;H01L21/66 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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