发明名称 SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME
摘要 PURPOSE: A substrate polishing device and a substrate polishing method using the same are provided to improve the reliability of products by fixing and installing a polishing end point detector on the upper side of a substrate support member aside from a polishing unit. CONSTITUTION: A substrate support member(100) receives a substrate on the upper side thereof and rotates the substrate. A polishing unit(300) polishes the substrate received on the substrate support member. A polishing end point detector(400) is fixed to the upper side of the substrate support member and detects the polishing end point of the substrate received in the substrate support member.
申请公布号 KR20100060656(A) 申请公布日期 2010.06.07
申请号 KR20080119342 申请日期 2008.11.28
申请人 SEMES CO., LTD. 发明人 KWON, OH JIN;KIM, SEONG SOO
分类号 H01L21/304;H01L21/66 主分类号 H01L21/304
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