PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printing circuit apparatus and a manufacturing method thereof are provided to reduce a thickness of the printing circuit apparatus by filling a circuit pattern to the inside a resin layer. CONSTITUTION: A printing circuit apparatus includes an insulator(12), a first and a second resin layer(14), a penetration hole, a conductive material(20), a circuit pattern(32) and a solder resist layer(40). The first and the second resin layer are laminated on both sides of the insulator. The penetration hole passes through the insulator and the first and the second resin layer. The conductive material is filled in the penetration hole. The circuit pattern is respectively buried on the first and the second resin layer. The circuit pattern is contacted with a sidewall of the conductive material. The solder resist layer is formed on a surface of the first and the second resin layer to protect the circuit pattern.