| 摘要 |
Disclosed is a primer resin for a semiconductor device having a lead frame comprising copper or 42 alloy, which comprises a polyamide resin represented by the formula[wherein Rrepresents a tetravalent aromatic residue of a tetracarboxylic acid selected from the group consisting of pyromellitic acid, 3,4,3',4'-diphenylethertetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3',4'-benzophenonetetracarboxylic acid; Rrepresents a bivalent residue of at least one diamine selected from the group consisting of diamino-4,4'-hydroxydiphenylsulfone, 4,4'-diamino-3,3',5,5'-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene; and n represents a number of repeats and is a positive integer of 10 to 1000]. Also disclosed is a semiconductor device having a layer of the primer resin between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin. Further disclosed is an epoxy resin composition for sealing a semiconductor, which comprises the primer resin. The semiconductor device is significantly improved in the adhesion between the lead frame and the cured product of the sealing resin composition, and has excellent heat resistance and low moisture absorption. |
