PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printing circuit apparatus and a manufacturing method thereof are provided to improve a reliability of an interfacial connection by separating a metallic compound between a conductive bump and an outer layer circuit. CONSTITUTION: A first substrate including a first pattern is prepared(S110). A second substrate including a carrier, a first metal layer and a second metal layer is prepared(S120). A conductive bump is formed on the second metal layer(S130). An insulator is laminated on the second metal layer(S140). The second substrate is laminated on the first substrate by a thermocompression(S150). The carrier is removed(S160). A second pattern is formed on the first metal layer by an electrolytic plating(S170). A part of the first metal layer is removed(S180). A part of the second metal layer is removed(S190).