| 摘要 |
PURPOSE: A mold for cutting a TAB IC(Tape Automated Bonding Integrated Circuit Film) and a manufacturing method thereof are provided to improve the positional precision of first and second openings and first and second alignment pin holes by simultaneously processing the first and second openings and the first and second alignment pin holes. CONSTITUTION: A manufacturing method of a mold for cutting a TAB IC comprises following steps. Upper and lower molds(110,120) are laminated. First and second openings are and first and second alignment pin holes are processed, the first and the second openings pass through the center of the upper and lower mold, and the first and the second alignment pin holes are placed on the both sides of the first and second openings and pass through the upper and lower molds. The punch is fixed to the upper mold. The upper and lower molds are aligned by inserting the alignment pins into the first and the second alignment pin holes. A guide member(160) is assembled with the upper and lower molds and moves the upper mold to the lower mold in order to cut the TAB IC placed on the lower mold by shearing force of the lower mold and a punch.
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