| 摘要 |
PROBLEM TO BE SOLVED: To provide a physical quantity sensor allowing defects occurring in a manufacturing process to be reduced and a method of manufacturing the same. SOLUTION: This physical quantity sensor includes a structure made by disposing a multilayer substrate between first and second substrates, the multilayer substrate made by layering a semiconductor film, an insulation film, and a semiconductor substrate, in order. The multilayer substrate includes a sensor structure and a columnar wiring, the sensor structure including a movable part. The first substrate is equipped with a through-hole and a through wiring disposed in the through-hole for acquiring conduction through the first substrate. The columnar wiring is equipped with a recess bored through the semiconductor film and the insulation film, and a conduction part disposed in the recess for acquiring conduction between above and below the columnar wiring. The first substrate and the multilayer substrate are disposed so that the through-hole is positioned above the columnar wiring and that the through-hole is prevented from overlapping with the recess. COPYRIGHT: (C)2010,JPO&INPIT |
