| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new processing method capable of forming a plating layer having sufficient adhesiveness when executing the etching treatment by using an etching liquid containing manganate in the electroless plating for a resin-formed body, and to provide a processing agent used in the processing method. Ž<P>SOLUTION: In the post-processing method of etching for a resin-formed body, the resin-formed body is etched by using the etching liquid containing manganate in a pre-processing step of the electroless plating to the resin-formed body, and the resin-formed body is brought into contact with the post-processing agent consisting of an aqueous solution containing a reducing compound and an amine compound. In a plating method for the resin-formed body, after executing the post-processing of the etching to the resin-formed body by the above-described post-processing method of etching, a catalyst for electroless plating is imparted to the resin-formed body, the electroless plating is executed, and as necessary, the electric plating is executed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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