| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device in which the bonding strength between a lead frame and a mould is increased by forming a fixing space on the lead frame through top and bottom planes to integrally forming a mould part on the top of the lead frame and in the fixing space. <P>SOLUTION: The light-emitting device includes a large number of lead frame parts each having at least a fixing space vertically passing through a body. The lead frame parts are disposed spaced apart each other. A light-emitting diode chip is mounted on the one of the large number of lead frames. The mould part is integrally formed on the top of the lead frame and in the fixing space to protect the light-emitting diode chip. <P>COPYRIGHT: (C)2010,JPO&INPIT |
