RESIN COMPOSITION

摘要

Disclosed is a resin composition suitable for forming an insulating layer of a circuit board, which exhibits excellent flexibility when used in the form of an insulating resin sheet.  Even when the surface roughness of an insulating layer obtained by curing the resin composition is low, a conductor layer having high peeling strength can be formed thereon. The resin composition contains a specific biphenyl aralkyl epoxy resin, a liquid polyfunctional epoxy resin, an epoxy curing agent, a thermoplastic resin and an inorganic filler.