| 摘要 |
PURPOSE: An apparatus for inspecting the cross-sectional shape of the inside of a wafer is provided to reduce a process time by simultaneously inspecting the surface and the cross-sectional shape of a wafer. CONSTITUTION: A first detector(110) detects the surface shape of a wafer. The first detector includes a secondary electron detector and a photomultiplier. A second detector(120) detects the cross-sectional shape of the wafer. The second detector includes an ultrasonic sensor and an ultrasonic signal detector. A control unit(130) selectively receives data from the first detector and/or the second detector. An image processing unit(150) processes the cross-sectional shape data of the wafer and output the data on a monitor.
|
