发明名称 CONDUCTIVE PASTE, AND CONDUCTOR PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductor pattern with high conductivity inexpensively, and to provide a conductor pattern with high conductivity inexpensively. SOLUTION: A conductive paste contains silver-coated copper powder and a binder resin with a glass transition temperature (Tg) of 35-170°C, wherein at least a part of a surface of the copper powder is coated with silver. An average particle diameter of the copper powder is preferably 0.001-50μm. The binder resin is preferably a cellulose derivative. An amount of the silver coating the surface of the copper powder is preferably 0.1-300 pts.wt. per 100 pts.wt. of the copper powder. After the conductive paste is printed on a base material in a predetermined shape, a conductor pattern is formed preferably by pressing or wet-heat treatment. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010123457(A) 申请公布日期 2010.06.03
申请号 JP20080297162 申请日期 2008.11.20
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KUWABARA MAKOTO
分类号 H01B1/22;H01B1/00;H01B5/14;H05K3/12 主分类号 H01B1/22
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