| 摘要 |
PROBLEM TO BE SOLVED: To bond an electronic component in an inert gas atmosphere even to a substrate which is large-sized and has many bonding positions with a small opening for insertion of a bonding head of a coating means by enabling the position of the opening to be changed. SOLUTION: The bonding device employs following means. Firstly, the bonding device includes a bonding head 3, a bonding stage 6, the substrate coating means 8, 9 on the stage, and an inert gas supply means for supplying inert gas into them, and bonds the electronic component 1 to the different positions of the one substrate a plurality of times in the inert gas atmosphere. Secondary, the coating means include an outer peripheral member enclosing the substrate, an upper member covering the top of the substrate and also having an opening into which the tip of the bonding head is inserted, and a coupling means for bringing both into contact with each other. Thirdly, the contact state is canceled to move the upper member relatively to the outer peripheral member, and the position of the opening relative to the substrate on the bonding stage is changed. COPYRIGHT: (C)2010,JPO&INPIT
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