RESIN MULTILAYER DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin multilayer device for achieving highly precise impedance and a low insertion loss, and for reducing the characteristic fluctuation of balun when a flip chip is mounted. SOLUTION: This WLP resin multilayer device having balun is provided with: a substrate 10; a first resin layer 22 formed on the substrate; balanced signal transmission paths 30 and 35 formed on the first resin layer 22; a second resin layer 24 formed on the balanced signal transmission paths; an unbalanced signal transmission path 50 formed so as to be faced to the balanced signal transmission paths 30 and 35 on the second resin layer 24; a third resin layer 26 formed on the unbalanced signal transmission path 50; and an insulating magnetic body 150 installed so that a portion of the region opposed to the unbalanced signal transmission path 50 is included on a third resin layer 26. COPYRIGHT: (C)2010,JPO&INPIT