发明名称 |
Semiconductor Package Leads Having Grooved Contact Areas |
摘要 |
A packaged semiconductor device (100) has a first (110) and a second (111) side, the second side including a plurality of metal terminals (120) extending to the first side. Each terminal includes an oblong groove (122) extending to the first side and ending in an orifice (123) at the first side. The terminals are made of a base metal and may have a solder-wettable surface except for the terminal surface (121) exposed at the first device side.
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申请公布号 |
US2010133693(A1) |
申请公布日期 |
2010.06.03 |
申请号 |
US20090405420 |
申请日期 |
2009.03.17 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ARSHAD MOHAMAD ASHRAF MOHD |
分类号 |
H01L23/488;H01L21/50 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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