发明名称 |
PACKAGE-ON-PACKAGE DEVICE, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an embedded component and a plurality of electric contacts, wherein the embedded component is located between the upper and lower surfaces of the interposer, and the electric contacts are located on the upper surface of the interposer. The molding compound seals the chip and covers the upper surface of the substrate and the lower surface of the interposer.
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申请公布号 |
US2010133675(A1) |
申请公布日期 |
2010.06.03 |
申请号 |
US20090565501 |
申请日期 |
2009.09.23 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
YU LIN WANG;WENG CHENG YI |
分类号 |
H01L23/52;H01L21/50;H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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