发明名称 METHOD FOR THE HOT EMBOSSING OF AT LEAST ONE CONDUCTOR TRACK ONTO A SUBSTRATE AND SUBSTRATE COMPRISING AT LEAST ONE CONDUCTOR TRACK
摘要 In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.
申请公布号 EP2191702(A1) 申请公布日期 2010.06.02
申请号 EP20080774864 申请日期 2008.07.08
申请人 ROBERT BOSCH GMBH 发明人 EHRENPFORDT, RICARDO;MAY, JOHANNA
分类号 H05K3/04 主分类号 H05K3/04
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