PRINTED CIRCUIT BOARD HAVING BURIED SOLDER BUMP AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board having a buried solder bump which improves the degree of matching between a solder bump and a circuit pattern and obviates a need for an additional coining process of the solder bump, and a manufacturing method therefor.

SOLUTION: The printed circuit board includes: an insulation layer 120; a solder bump 116 which is buried in the insulting layer 120 to be flush with the surface of the insulating layer; a circuit pattern 118 formed on the lower surface of the solder bump 116; and a circuit layer 108a connected to the circuit pattern 118 and buried in the insulting layer to be flush with the surface of the insulating layer 120.

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