| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor bar that suppresses damage to a cleavage surface of the semiconductor bar. SOLUTION: The method of manufacturing the semiconductor bar includes the processes of: mounting a substrate product 1 and a first semiconductor bar 19 on a support surface 20a of a first cradle 20 and a support surface 21a of a second cradle 21; positioning an edge 22a of a blade 22 at a scribe groove 17 on a principal surface of the substrate product 1 after mounting the substrate product 1; sandwiching the substrate product 1 between a support surface 22b of the blade 22 and the support surface 21a of the second cradle 21 after positioning the blade 22 at the scribe groove 17; cleaving the substrate product 1 by moving the first cradle 20 relatively to the second cradle 21 in the direction of an axis extending from the support surface 21a of the second cradle 21 to the support surface 22b of the blade 22 after sandwiching the substrate product 1 to form a new substrate product 2 and a second semiconductor bar 23. COPYRIGHT: (C)2010,JPO&INPIT |
