| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor devices for bonding a semiconductor element to a support member for mounting the semiconductor element, such as a lead frame and an organic substrate even in a relatively low temperature region without causing any troubles in adhesiveness and workability, and for restraining occurrence of voids. <P>SOLUTION: By the method of manufacturing semiconductor devices, the semiconductor element 21 is bonded to the support member 23 via a cured product 22 of an adhesive film. The method includes: a process (a) for preparing the semiconductor element including the adhesive film; a thermocompression process (b) for thermally compressing the semiconductor element including the adhesive film to the support member to obtain a semiconductor part comprising the semiconductor element including the adhesive film, and the support member; a pressure curing process (c) for heating and pressing the semiconductor part comprising the semiconductor element including the adhesive film, and the support member by a pressurized fluid to advance the curing of the adhesive film; and a process (d) for electrically connecting the semiconductor element to the support member. The processes (a) to (d) are performed in this order. <P>COPYRIGHT: (C)2010,JPO&INPIT |
