发明名称 |
COOLER FOR REFLOWED SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a cooler for a reflowed substrate, for capturing a liquefied flux even if a flux gas in a cooled air flown to between a blowing plate and a substrate is liquefied. SOLUTION: The blowing plate 8 is installed above a carrying conveyer 5 and a substrate 7 in a cooling chamber 1. The blowing plate 8 is molded so that a cross section may be a mount. A plurality of blowing holes 8a penetrating through front and rear are formed on the blowing plate 8. A porous metal body 9 made of a metal having a high specific surface area is disposed so as to be integrated with the blowing plate 8. The porous metal body 9 captures a flux liquefied in a space between the blowing plate 8 and the carrying conveyer 5 and a flux passing through the blowing holes 8a of the blowing plate 8. The fluxes captured by the porous metal body 9 move to a flux collecting section 10a along its gradient. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010118387(A) |
申请公布日期 |
2010.05.27 |
申请号 |
JP20080288739 |
申请日期 |
2008.11.11 |
申请人 |
TAMURA SEISAKUSHO CO LTD;TAMURA FA SYSTEM CO LTD |
发明人 |
MATSUHISA SHOICHIRO;OKANO TERUO |
分类号 |
H05K3/34;B23K1/00;B23K31/02;B23K101/42 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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