| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-height and highly-airtight acoustic wave filter apparatus provided with a matching circuit in a package. <P>SOLUTION: The acoustic wave filter apparatus 101 is provided with an acoustic wave element 60, a base substrate 50, bumps 72 and 73, an airtight sealing frame 71, and an exterior resin 80. The acoustic wave filter apparatus 101 comprises a plurality of surface acoustic wave filters, and an interdigital transducer electrode (IDT electrode) and a wiring electrode connected to the IDT electrode are provided on one main surface of a piezoelectric substrate. Also, at the outer periphery of the piezoelectric substrate, the airtight sealing frame 71 is provided so as to surround the IDT electrode and the wiring electrode over the entire periphery. In the base substrate 50, an upper part comprises a ceramic substrate 40, and a lower part comprises a resin substrate 30. A conductor pattern 33 configuring a matching circuit is formed in the resin substrate 30 forming the lower part of the base substrate 50, and mounting terminals 34 and 35 are formed on the bottom surface, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT |
