发明名称 METHOD OF PRODUCING NICKEL SINTERED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of producing sintered substrates of which the respective rows become identical in solution holding characteristics even when the sintered substrates formed in numerous rows are produced. SOLUTION: The method of producing a nickel sintered substrate 10 includes: a slurry coating step in which a slurry coating substrate 11a is formed by coating a nickel slurry 12 containing a nickel powder, a pore-forming agent and a thickener on a conductive core 11 so that the sintered substrates are formed in a plurality of rows; a drying step in which a slurry dry substrate 11b is formed by drying a slurry of the slurry coating substrate 11a; a thickness adjustment step in which a thickness adjustment substrate 11c is formed by adjusting the thickness of the slurry dry substrate 11b; and a sintering step in which the thickness adjustment substrate 11c is sintered. Then, in the thickness adjustment step, the thickness is increased or decreased in a range of 20 μm or more and 150 μm or less with respect to the thickness of the slurry dry substrate 11b in the thinnest row among the slurry dry substrates 11b before thickness adjustment. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010118317(A) 申请公布日期 2010.05.27
申请号 JP20080292550 申请日期 2008.11.14
申请人 SANYO ELECTRIC CO LTD 发明人 HARADA IKUKO;SAKATANI TOSHIHIRO;KUDO YASUHIRO;NAGAE TERUHITO;NII HIROKI;FUJIKAWA HIDEYUKI;NAKADA NAOKI;FUJISAWA KAZUHIRO
分类号 H01M4/80;B22F3/02;B22F7/04 主分类号 H01M4/80
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