| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspection method which enables the inspection of hole patterns even if more scaled down. SOLUTION: The surface inspection method for inspecting the surface of a wafer based on diffracted light, wherein a hole pattern is formed in an arrangement having a pitch spacing smaller than a minimum pitch capable of generating the diffracted light on the surface of the wafer, includes: a step S101 of extracting a hole pattern arranged at a repetitive pitch greater than the minimum pitch; a step S102 for irradiating the surface of the wafer with inspection light so as to generate the diffracted light corresponding to the repetitive pitch of the hole pattern extracted in the step S101; a step S103 for detecting the diffracted light generated by irradiation with the inspection light in the step S102; and a step S104 for inspecting for any defect in the hole pattern based on the diffracted light detected in the step S103. COPYRIGHT: (C)2010,JPO&INPIT
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