发明名称 DEVICE AND METHOD FOR INSPECTING FLAW
摘要 <P>PROBLEM TO BE SOLVED: To provide a flaw inspecting device inspecting the flaws of both of a part coated with a solder resist and an uncoated part in a short inspection period of time by a simple feed mechanism, and also to provide a flaw inspecting method. Ž<P>SOLUTION: A circuit pattern inspecting device for inspecting the flaw of a circuit pattern having regions different in light reflectivity is equipped with: an illumination means for irradiating the circuit pattern with light; an imaging means for acquiring the image data of the circuit pattern; an image region dividing means for dividing the image data after acquired corresponding to regions different in pixel value; a gradation number converting means for converting the gradation number of the region set to an inspection target among the divisions; and a flaw detecting means for detecting the flaw on the basis of the image data before or after conversion. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010117142(A) 申请公布日期 2010.05.27
申请号 JP20080288477 申请日期 2008.11.11
申请人 TORAY IND INC 发明人 NAKAI YASUHIRO;IKETANI SHUICHI
分类号 G01N21/956;G06T1/00 主分类号 G01N21/956
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