| 摘要 |
One embodiment of a photodetecting semiconductor apparatus is provided with a sensor chip, a resin-sealed package in which the sensor chip is resin-sealed with a transparent resin, and a color filter disposed on the surface of the sensor chip, with a sensor circuit unit and a light-sensitive element group being formed in the sensor chip. The light-sensitive element group is configured with a color light-sensitive element having a sensitivity peak for color and an infrared light-sensitive element having a sensitivity peak for infrared light. The color light-sensitive element includes a red light-sensitive element having a sensitivity peak for red, a green light-sensitive element having a sensitivity peak for green, and a blue light-sensitive element having a sensitivity peak for blue.
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