发明名称 |
METAL INJECTION MOLDED HEAT DISSIPATION DEVICE |
摘要 |
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein tile base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
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申请公布号 |
US2010127388(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20080323318 |
申请日期 |
2008.11.25 |
申请人 |
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发明人 |
STANLEY GAVIN D.;CROCKER MICHAEL T. |
分类号 |
H01L23/34;B21D53/02;F28F7/00 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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