发明名称 ROTARY MAGNET SPUTTERING APPARATUS
摘要 In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.
申请公布号 US2010126852(A1) 申请公布日期 2010.05.27
申请号 US20080593660 申请日期 2008.03.28
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;TOKYO ELECTRON LIMITED 发明人 OHMI TADAHIRO;GOTO TETSUYA;MATSUOKA TAKAAKI
分类号 C23C14/35 主分类号 C23C14/35
代理机构 代理人
主权项
地址