发明名称 PLASMA PROCESSING APPARATUS
摘要 In a plasma processing apparatus; a refrigerant flow passage being formed in the sample table and constituting an evaporator of a cooling cycle and the in-plane temperature of the sample to be processed is controlled uniformly by controlling the enthalpy of the refrigerant supplied to the refrigerant flow passage and thereby keeping the flow mode in the refrigerant flow passage, namely in the sample table, in the state of a gas-liquid two-phase. If by any chance dry out of the refrigerant occurs in the refrigerant flow passage because the heat input of plasma increases with time or by another reason, it is possible to increase speed of a compressor and inhibit the dry out from occurring in the refrigerant flow passage. Further, if the refrigerant supplied to the refrigerant flow passage is liquefied, it is kept in the gas-liquid two-phase state.
申请公布号 US2010126666(A1) 申请公布日期 2010.05.27
申请号 US20090368412 申请日期 2009.02.10
申请人 TANDOU TAKUMI;YOKOGAWA KENETSU;IZAWA MASARU 发明人 TANDOU TAKUMI;YOKOGAWA KENETSU;IZAWA MASARU
分类号 H01L21/3065 主分类号 H01L21/3065
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