RFID-EMBEDDED PRINTED CIRCUIT BORAD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit substrate including an electronic tag and a manufacturing method thereof are provided to improve reliability of a process of manufacturing PCB by offering a whole flow chart of manufacturing a substrate in using the electronic tag on a core of inside substrate. CONSTITUTION: A printed circuit substrate is formed by laminating an insulating layer and a copper foil layer in an outer layer of an inner core. Copper clad surface of a resin-coated and copper clad structure(100) is etched partly on both sides(100a, 100c) which located on a gap of the insulating layer(100b). A copper clad cavity is formed on an exposed surface of the insulating layer. The adhesive is spread on an internal side of the exposed insulating layer. A electronic tag is mounted on the adhesive.