发明名称 BOILING AND COOLING DEVICE
摘要 A boiling and cooling device is provided with a heat receiving section for boiling a liquefied refrigerant to convert the liquefied refrigerant to vapor and cooling a device to be cooled by being in contact with the device to be cooled, a vapor tube connecting to the upper part of the heat receiving section and conveying vapor generated by the heat receiving section, a heat dissipating section for dissipating heat to the atmosphere while condensing the vapor, which is conveyed from the vapor tube, to convert the vapor to a liquefied refrigerant, and a liquid tube for returning to the heat receiving section the liquefied refrigerant condensed by the heat dissipating section.  At least a part of the cross-sectional area of the flow path for the vapor in the heat receiving section is gradually reduced from the lower part of the heat receiving section toward the upper part of the heat receiving section.
申请公布号 WO2010058520(A1) 申请公布日期 2010.05.27
申请号 WO2009JP05577 申请日期 2009.10.22
申请人 NEC CORPORATION;SAKAMOTO, HITOSHI;YOSHIKAWA, MINORU;HASHIGUCHI, TAKEYA 发明人 SAKAMOTO, HITOSHI;YOSHIKAWA, MINORU;HASHIGUCHI, TAKEYA
分类号 H01L23/427;F28D15/02;H05K7/20 主分类号 H01L23/427
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