| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of a band-like substrate material for manufacturing a semiconductor mounting substrate of high stability in product dimension. Ž<P>SOLUTION: In the processing method of the band-like substrate material, a next reference hole is opened by forming a coordinates, with the hole having been opened already as a reference, when the reference hole is opened on the band-like substrate material 1 in order to manufacture a semiconductor mounting substrate where a reference hole H<SB>1</SB>is opened on the band-like substrate material 1 and a substrate circuit is exposed and developed, with the reference hole as a reference, so that a predetermined circuit pattern is formed on the band-like substrate material 1. A side edge E of the band-like substrate material 1 is monitored not to cause defective processing due to the effect of meandering or the like of the band-like substrate material 1. Displacement of reference hole position to be opened due to meandering or the like of the band-like substrate material 1 is fed back to an opening position for adjustment. Displacement amount between patterns is managed for a reference hole coordinates to be opened which is calculated for feeding back the meandering effect of two or more existing reference holes and two or more next band-like substrate materials, for determining the next reference hole coordinates to be opened. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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