发明名称 COMPONENT-CARRYING TAPE
摘要 <P>PROBLEM TO BE SOLVED: To provide a component-carrying tape which can protect a component mounted thereon when it is rolled without a spacer. Ž<P>SOLUTION: A semiconductor-carrying tape 10 is made by mounting semiconductor elements 2 on a flexible tape member 1. The semiconductor-carrying tape 10 has a plurality of projections 5 arranged along the length of the tape member 1, so that the tape member 1 of the semiconductor-carrying tape 10, which is adjacent to and overlapping the semiconductor element 2, is prevented from coming into contact with the semiconductor element 2 when the semiconductor-carrying tape 10 is rolled. This makes a spacer unnecessary, thus cuts weight and cost equivalent to those of the spacer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010118451(A) 申请公布日期 2010.05.27
申请号 JP20080289924 申请日期 2008.11.12
申请人 SHARP CORP 发明人 NAKAMURA NAKAE
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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