| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique of effectively producing a chucking force and, for example, preventing an insulating substrate made of resin or the like from thermally deforming in a case where a conductive thin film is formed on the insulting substrate by the use of an electrostatic chuck plate. SOLUTION: An insulating substrate 5 is placed on the surface of an electrostatic chuck plate 21 and first power is supplied to a target 3 to form a conductive thin film on the surface of the insulating substrate 5 and then when the thickness of the conductive thin film becomes predetermined, second power higher than the first power is supplied to the target 3 to form the film at high film forming speeds. When the higher second power is supplied to the target 3, large heat is supplied to the insulating substrate 5, but an electrostatic chucking force large than a gradient force is produced between the conductive thin film and the electrostatic chuck plate 21 to strongly chuck the insulating substrate 5 by the electrostatic chuck plate 21, whereby the insulating substrate 5 is sufficiently cooled by the electrostatic chuck plate 21 cooled. Thus, even if the conductive thin film is formed at high film forming speeds, the insulating substrate 5 is prevented from excessively increasing its temperature and from thermally deforming.</p> |
