LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE PACKAGE MODULE HAVING THE SAME

摘要

PURPOSE: A light emitting diode package and a light emitting diode package module including the same are provided to improve heat discharge efficiency by extending a pair of electrode patterns along the side of a ceramic substrate to be exposed to the outside. CONSTITUTION: A ceramic substrate includes a cavity(112) on one side. A light emitting diode(120) is received in the cavity. A pair of electrode patterns(130) are formed on the ceramic substrate and are electrically connected to the light emitting diode. The pair of electrode patterns are extended along the side of the ceramic substrate to be exposed to the outside.