PURPOSE: An optical modulator module package is provided to miniature a package while reducing the whole area by laminating a light modulator element and a driver IC. CONSTITUTION: A light modulator module package comprises a substrate(2), a driver IC(14), and a light modulator element(10). The driver IC is attached on the substrate. The driver IC comprises a first pad(16) in upper part. The driver IC generates the driving voltage according to a control signal. The driver IC outputs a driving voltage through a first pad. The light modulator element comprises a second pad(8) in a lower part. The light modulator element comprises a micro mirror(12). The micro-mirror outputs a diffracted light. The light modulator element is laminated on the driver IC which having a via hole(18).
申请公布号
KR20100055200(A)
申请公布日期
2010.05.26
申请号
KR20080114165
申请日期
2008.11.17
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, HYUN KEE;LEE, YEONG GYU;PARK, CHANG SU;BAE, JUN HEE