发明名称 ASSEMBLY METHOD FOR IMPLANTABLE MEDICAL DEVICE
摘要 <p>An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.</p>
申请公布号 EP2188013(A2) 申请公布日期 2010.05.26
申请号 EP20090733999 申请日期 2009.04.22
申请人 MEDTRONIC, INC. 发明人 ENGMARK, DAVID, B.;GROSE, GARY, M.;SCHAEFER, TODD, H.;CEBALLOS, THOMAS, I.;RIES, ANDREW, J.
分类号 A61N1/375;H05K1/11;H05K1/14;H05K1/18;H05K3/00 主分类号 A61N1/375
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